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Semi-conductor
The HYDR-STAR pneumatic pump can be used in the semiconductor industry, such as in chip wafer cleaning and chip packaging applications.
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Semi-conductor
In the semiconductor industry, HYDR-STAR pneumatic pumps can be used in chip wafer cleaning and chip packaging applications.
• Chip wafer cleaning: Utilizing oil-free, clean, high-pressure gas/liquid flows to drive deionized water and chemical cleaning solutions into high-speed jets, precisely removing nanoscale particles and residual photoresist from the wafer surface. Combined with ultrasonic technology, this process achieves highly efficient cleaning while preventing secondary contamination—a core requirement in the semiconductor industry.
• Chip packaging process: Provides stable, adjustable high-pressure gas that is used, on the one hand, to control the bonding pressure between the chip and substrate (ensuring bonding accuracy), and on the other hand, to drive uniform dispensing of encapsulant, remove excess overflow glue after encapsulation, and accommodate mainstream package types such as BGA and QFP, thereby guaranteeing the sealing performance and reliability of the package.
• Chip silver sintering packaging technology is a chip interconnection technique specifically designed for applications with high performance and high reliability requirements. It utilizes micron- or nanometer-sized silver particles, which, under pressure at temperatures significantly below the melting point of silver (typically <300℃), enable atomic diffusion between particles to form a robust bond, thereby creating an interconnect layer that is both highly resistant to high temperatures (>700℃) and boasts excellent thermal and electrical conductivity. HYDR-STAR can provide high-pressure gas boosting equipment tailored for use with sintering machines.

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